Industrial Communication | Siemens | 6ES7 138-4FB04-0AB0 6ES7138-4FB04-0AB0 DP ELECTRON MODULE FOR ET200S

Product Description: Siemens 6ES7138-4FB04-0AB0

The Siemens 6ES7138-4FB04-0AB0 is a High Feature power module from the SIMATIC ET 200S distributed I/O system, designed to supply 24 V DC power to the electronic modules and sensors within the station. It supports advanced diagnostics and hot swapping functionality, ensuring uninterrupted system operation and enhanced visibility for fault detection. Ideal for applications requiring dependable power distribution and robust system segmentation.

Key Features

• Supplies 24 V DC to ET 200S modules and sensors
• High Feature version with extended diagnostics
• Enables segmentation of power groups within the I/O station
• Supports hot swapping without system shutdown
• Integrated diagnostic LEDs for status monitoring
• DIN rail mountable and compact form factor
• Galvanic isolation between field and internal electronics

Technical Specifications

• Part Number: 6ES7138-4FB04-0AB0
• Rated Input Voltage: 24 V DC
• Rated Output Voltage: 24 V DC
• Max Output Current: 10 A (shared with modules and sensors)
• Voltage Drop: < 0.5 V
• Diagnostics: Yes (overload, short circuit, wire break)
• Isolation: Galvanic between field supply and backplane bus
• Module Width: 15 mm
• Mounting Method: DIN rail, directly plugged into ET 200S
• Protection Class: IP20
• Operating Temperature: 0 °C to +60 °C
• Storage Temperature: –40 °C to +70 °C
• Weight: Approx. 50 g
• Certifications: CE, cULus, EAC

Application Areas

• Distributed I/O stations in factory and process automation
• Applications requiring segmented power distribution
• Sensor and actuator supply with diagnostics
• Modular machines with hot- swappable module requirements
• Systems using PROFIBUS or PROFINET via ET 200S interface modules

Advantages

• Ensures safe and reliable 24 V DC distribution in ET 200S systems
• Enhanced diagnostic capabilities reduce troubleshooting time
• Supports modular design with electrical isolation and hot swapping
• Improves system availability and operational transparency
• Compact footprint allows high-density I/O configurations