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Industrial Communication | Siemens | 6ES7193-6BP00-0DA0 6ES7 193-6BP00-0DA0 SIMATIC ET 200SP BaseUnit

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Condition: Brand new
Warranty: 2 Year Rabwellplc Warranty
Shipping: Free Expedited Shipping.
Located in: South El Monte, California, United States
Delivery: Estimated between 3 - 5 Days
Returns: 30 days returns. Seller pays for return shipping
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Product Description: 6ES7193-6BP00-0DA0

The 6ES7193-6BP00-0DA0 is a BU15-P16+A0+2D BaseUnit for the SIMATIC ET 200SP distributed I/O system. As the foundation of an ET 200SP station, it provides 16 process connections via push-in terminals and supplies both power and data through its built-in backplane bus. Its slim 15 mm width and 117 mm height optimize panel space, while the A0 type design omits auxiliary terminals for a simplified wiring layout. This BaseUnit supports hot-swap replacement when used with compatible interface modules, ensuring minimal downtime.

Key Features

  • 16 Process Connections: Push-in terminal blocks for straightforward module wiring
  • Backplane Bus Interface: Delivers power and data to all connected I/O modules
  • Slim 15 mm Profile: High I/O density in compact control panels
  • No Auxiliary Terminals: Streamlined design for simpler installations
  • Hot-Swap Capability: Replace modules on the fly when used in hot-swap stations
  • Robust Construction: Industrial-grade for reliable operation in harsh environments

Technical Specifications

  • Part Number: 6ES7193-6BP00-0DA0
  • BaseUnit Type: A0
  • Load Group: New Load Group (light color code)
  • No. of Connections: 16
  • Auxiliary Terminals: None
  • Terminal Type: Push-in
  • Backplane Bus: Power and data via ET 200SP bus
  • Module Width: 15 mm
  • Module Height: 117 mm
  • Protection Class: IP20 (cabinet installation)
  • Operating Temperature: –30 °C … +60 °C
  • Mounting: DIN-rail in control cabinet

Application Areas

  • Foundation for ET 200SP I/O stations in machine and plant automation
  • High-density digital, analog, and technology module configurations
  • Distributed I/O systems requiring compact footprint and modular flexibility
  • Hot-swap capable architectures for critical process control

Advantages

  • Maximizes I/O channel density with minimal panel space
  • Simplifies wiring with integrated push-in terminals and no AUX blocks
  • Enables uninterrupted operation via hot-swap support
  • Provides reliable backplane distribution of power and signals
  • Seamlessly integrates with TIA Portal engineering for streamlined configuration
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