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Industrial Communication | Siemens | 6ES7193-6BP00-0BA1 6ES7 193-6BP00-0BA1 SIMATIC ET 200SP BaseUnit
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Condition:
Brand new
Warranty:
2 Year Rabwellplc Warranty
Shipping:
Free Expedited Shipping.
Located in: South El Monte, California, United States
Located in: South El Monte, California, United States
Delivery:
Estimated between 3 - 5 Days
Returns:
30 days returns. Seller pays for return shipping
Payments:
Payment methods
Product Description: Siemens 6ES7193-6BP00-0BA1
The Siemens 6ES7193-6BP00-0BA1 is a BaseUnit (BU) designed for the SIMATIC ET 200SP distributed I/O system. It serves as the mechanical and electrical interface between the backplane bus and the plug-in I/O modules such as digital and analog input/output modules. As a Type A0 base unit, it supports standard (ST) and high feature (HF) modules, enabling efficient and tool-free module replacement while maintaining secure and reliable connectivity.
Key Features
- BaseUnit for mounting ET 200SP I/O modules
- Type A0 supports ST (Standard) and HF (High Feature) modules
- Integrated backplane contact for system bus connection
- Tool-free assembly and module exchange
- Wire break detection and channel diagnostics support (depending on module)
- Compact footprint to enable high-density configurations
- Screw-type terminal compatibility via separate terminal blocks
Technical Specifications
- Part Number: 6ES7193-6BP00-0BA1
- Type: BaseUnit Type A0
- Module Compatibility: ET 200SP Standard and High Feature I/O modules
- Electrical Interface: Integrated backplane bus contact
- Terminal Interface: For separate terminal blocks (e.g., push-in or screw-type)
- Width: 15 mm
- Mounting Method: DIN rail
- Protection Class: IP20
- Operating Temperature: 0 °C to +60 °C
- Storage Temperature: –40 °C to +70 °C
- Relative Humidity: 5% to 95% (non-condensing)
- Certifications: CE, cULus, EAC
Application Areas
- Distributed I/O systems using ET 200SP architecture
- Modular and scalable automation solutions
- Control cabinets in industrial automation environments
- Flexible I/O expansion in machinery and process control
- Systems requiring fast maintenance and high channel density
Advantages
- Simplifies I/O module installation and maintenance
- Ensures secure electrical connection to backplane bus
- Supports quick hot-swapping of modules without rewiring
- Compact design optimizes control panel space
- Fully integrated into TIA Portal and Siemens ET 200SP ecosystem

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